Electronic Design

Tuesday, October 19, 2004

Advances in Signal Integrity Testing

Advances in Signal Integrity Testing
This technical seminar will focus on new techniques and technology for signal integrity testing. Topics covered will include methods an engineer can use to test the effect of probe loading on signal shape, techniques for checking the affect on signal integrity of some new scopes which use DSP to boost bandwidth and next generation capability to deskew both timing delay and DC gain/offset at the probe tip when testing multiple signals. Examples will be given of real signals in practical applications including serial data streams and microprocessor/memory systems. This seminar is targeted to hardware design engineers who need to verify proper circuit performance or troubleshoot problems.

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